Heart electronic has long cooperated with major electronic product manufacturers at home and abroad, and has accumulated rich and professional SMT foundry experience, providing SMT foundry services in the electronic product manufacturing process, and has repeatedly won good reputation in the domestic SMT industry.

Heart’s DIP process is a dual-in-line package component mounting process, which is a process that combines traditional electronic components and PCB. Modern new electronic products have emphasized lightness, thinness and short size, so most DIP parts have been SMD Replaced by parts.

As the packaging methods of semiconductor product components are becoming more and more miniaturized, better X-ray inspection equipment is needed to ensure the demand for miniaturization of product components.

AOI equipment used in both PCB and PCBA industry is mainly divided into three parts