High Temperature Solder Pastes Industry Market Growth

The global High Temperature Solder Pastes market report provided by Global Market Monitor helps customers and companies formulate market strategies, and provides in-depth analysis of driving factors, limiting factors, and the latest trends in the market during the forecast period.

High temperature solder paste is accompanied by SMT emerged as a new type of welding material, and it is mixed with solder powder, flux, surface active agent, and thixotropic agent. High temperature solder paste presents in the formation of paste mixture. It is mainly used for SMT industry PCB surface resistance, capacitance, IC and other electronic components welding. The melting point of high-temperature solder paste is between 217-227?. Its alloy composition is generally tin, silver and copper (SAC for short). High temperature solder paste is mostly used in the first reflow soldering printing.

The main driving factor of the global high temperature solder paste market is the rapid development of the solder market. High temperature solder paste is mostly used in the first reflow printing and is an important raw material for the soldering process. In addition, compared with ordinary solder paste, high-temperature solder paste has excellent wettability, so that solder smell does not appear during the reflow process. In addition, the high oxidation resistance and temperature resistance of the high temperature solder paste make the printing performance excellent, and it will not collapse during normal temperature and preheating. High temperature solder paste has less residue, low odor, non-corrosiveness, and high cost performance. It is the first choice of most manufacturers. During the forecast period, the market share of high temperature solder paste will maintain a steady increase and achieve a high compound annual growth rate.